Ammonia Molecular contamination
As semiconductor device geometry and size continue to decrease into the deep sub-micron level, the importance of ammonia molecular contamination (AMC) control has become as important as the particle contamination or even more critical.
Ammonia (NH3) and acids (HCl, HF, ...) have direct and dramatic effects on photolitographic processes.
The level of impurities can be critical at very low concentrations down to the ppb level or even below.
The exposure of wafers to ammonia and acids introduces structural defaults, such as incorrect imprinted line-width, leading to components failures. The early detection of molecular contamination during wafer imprinting, minimizes linewidth damage
(T-topping) and lens or mask hazing. Appropriate trace gas monitoring improves the productivity of the plant and avoids the destruction of large production batches.
TGA320-xl - Ammonia TRACE GAS ANALYZER
Omnisens TGA320-XL is the perfect tool for Ammonia monitoring in semiconductor cleanrooms for DUV lithography and overall contamination monitoring.
Omnisens TGA320-XL real-time Ammonia Trace Gas Analyzer product range radically improves the productivity of DUV photolithographic processes through early detection of contamination sources. The TGA320-XL has been carefully designed to meet the demanding requirements of the semiconductor industry outlined in the ITRS roadmap.
The system gives outstanding performance for early detection of contaminants, inputities and outgassing process in minienvironment continuous monitoring as well as for standalone instrument for contamination souzrces investigation. The user-friendly operation, makes it the most convienient and advanced solution available for the monitoring of ammonia contamination in all fab areas.